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Item
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Standard
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Advanced
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• Minimum
Line/Spacing, Internal
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3/3
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3/3
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• Minimum
Line/Spacing, External
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4/4
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3/3
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• Minimum
Drilled Hole Size
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8
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6
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• Aspect
Ratio (Thickness to Drill)
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10:1
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15:1
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• Anular
Ring (Diameter over Drill)
|
10
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8
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• Anti-pad
(Diameter over Drill)
|
20
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16
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• Plated
Hole Tolerance
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±3
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±2
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• Minimum
Dielectric Thickness
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3
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2
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• Maximum
PCB Thickness (inches)
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0.200
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0.250
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• Thickness
Tolerance (% of Thickness)
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±10
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±7
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• Maximum
PCB Dimensions (inches)
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42.0 X
35.0
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46.0 X
35.0
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• Fabricated
Dimensions - NC Routing
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±5
mils
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±3
mils
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•
Layer-to-Layer Registration Tolerance
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±5
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±3
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• Solder
Mask Clearance, Per Side
|
2.0
mils
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1.5
mils
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•
Blind/Buried Vias (All Types)
|
yes
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yes
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• Via Fill
(Conductive, Non-Conductive)
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no
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yes
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Inner
Layers
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Standard
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Advanced
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• Minimum
Core thickness
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3 mils
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2 mils
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• Minimum
Line width
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4 mils
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3 mils (H Oz copper)
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• Minimum
Spacing (Air gap)
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4 mils
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3 mils (H Oz
copper)
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• Minimum
pad size
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Drill size+10
mils
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Drill Size+7
mils
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• Minimum
Anti Pad (planes)
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Drill Size+20
mils
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Drill Size+16
mils
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Outer
Layers
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Standard
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Advanced
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• Max.
Finished Thickness
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0.200
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0.250
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• Thickness
Tolerance
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±10%
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±5%
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• Max.
Aspect Ratio
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10:1
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12:1
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• Min. Drill
Size
|
10
mils
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8 mils
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• Min. Line
width
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4 mils
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3 mils
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• Min.
Spacing (air gap)
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4 mils
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3 mils
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• Min.
Solder mask clearance
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4 mils
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3 mils
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• Min.
solder mask web thickness
(mask between pads)
|
4 mils
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3.4
mils
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