Finish	Description
	HASL (Hot Air Solder Leveled)	Solder is deposited on features that are not covered with Solder Mask. Solder Thickness varies from 0.2 to 1.2 mils. This variation is due to board circuit density, aspect ratio. Solder consists of 63%/37% eutectic Tin/lead
	OSP (Organic Solderability Preservative)	A transparent organic coating is deposited on features that are not covered with solder mask.
	ENIG (Electrolyses Nickel/Gold)	Electrolyses nickel and Electrolyses gold is deposited on features that are not covered with Solder Mask. Thickness for Nickel is between 80 to 150 micro inches and Gold thickness is 3-6 micro inches.
	Gold Flash	Electrolytic nickel-gold deposited on solderable features. Typically 150-200 micro inches of nickel is deposited, and 5-10 micro inches of Hard gold. Gold flash is applied to features after pattern Copper plating.
	Immersion Silver	Silver is deposited on features not covered with solder mask. Thickness of silver is 4 to 20 micro inches.
	White Tin	Immersion tin is deposited on features not covered with Solder mask. Thickness is typically 30-40 micro inches.
	Carbon Ink for Key pad application	A conductive carbon paste is applied on selective pads for contact purposes, e.g.. Keypads of calculators, etc.
	Wire Bondable Soft Gold	Electrolytic soft gold is plated on features that require bondable gold for wire bonding application. Depending on the type of wire bonding used, the thickness of gold varies from 20 to 50 micro inches. Nickel thickness is between 150 to 250 micro inches.
	Palladium	Palladium  harder than cobalt gold, is precious, and also retains the non-oxidizing property for use in electrical connector applications. Palladium electrodeposits have higher better ductility, which provides superior contact bending tolerance, lower porosity, and superior resistance to corrosion than hard gold. This makes palladium an excellent candidate for applications such as reed switches or relay contacts. When underplated with a flash of soft gold, palladium also demonstrates excellent solderability.